VORAGO Technologies delivers system-in-package prototypes to NASA
(26 July 2019 - VORAGO Technologies) VORAGO Technologies has delivered prototype samples and evaluation kits to NASA as part of an ongoing NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA).
The project that is now at an advanced stage is consistent with VORAGO’s integrated circuit technology expertise and is a key milestone in the project to develop a flight qualified radiation-hardened miniaturized System-In- Package (SIP). The SIP is optimized for size, weight, power consumption and radiation hardness.
(courtesy: VORAGO Technologies)
As spacecraft technology is continually miniaturized to reduce size, weight and power consumption, it is becoming increasingly challenging for designers to implement advanced system functionality into a tiny form factor. VORAGO has developed SIP technology that integrates multiple radiation-hardened die and are now qualifiying the SIP device for space flight. The SIP implementation is five times smaller than an equivalent circuit that utilizes conventional discrete ICs.
“We are delighted to have produced prototype SIP devices with hardware and software development tools,” said Bernd Lienhard, chief executive officer at VORAGO Technologies. “our next step is to follow the MIL-PRF-38534 class K qualification flow to provide flight units to NASA.” Several NASA Centers are currently evaluating the prototype units for future missions.
About VORAGO Technologies
VORAGO Technologies is a privately held, high technology company based in Austin, TX with patented and proven solutions that enable electronics systems for extreme temperature and radiation environments. VORAGO’s patented HARDSIL technology uses cost effective high volume manufacturing to harden any commercially designed semiconductor component for extreme environment operation. VORAGO Technologies opens up a new world of possibilities for your designs, no matter how hostile the environment.